ResearchMoz

Energy Harvesting and Storage for Electronic Devices 2012-2022

Publisher Name » IDTechEx
Published Date » 2012-08-01
No. Of Pages » 411


Energy harvesting is otherwise known as power harvesting or energy scavenging. It is the use of ambient energy to power small electronic or electrical devices. That means solar cells on satellites, heat powered sensors buried in engines, vibration harvesting for helicopter electronics and the wind- up radio or lantern. However, there are also several more esoteric options.
Energy harvesting has reached a tipping point. This is because the necessary lower power electronics and more efficient energy gathering and storage are now sufficiently affordable, reliable and longer lived for a huge number of applications to be practicable. From wind-up laptops for Africa to the wireless light switch working from the power of your finger, these things are either available or imminently available. And photovoltaics, long used in aerospace, has come down-market, even to road furniture but it has much further to go even to disposable solar film and even solar paint. The first solar powered watches and phones have appeared. Some new photovoltaic technologies are printed reel to reel at low cost, the resulting film working off heat as well as light. For example, Sony is commercialising flexible solar cells for indoor use.
However, there are further mountains to climb from self powered wireless sensors monitoring forest fires, pollution spillages and even inside the human body and in the concrete of buildings. These applications will become commonplace one day. Even devices with maintenance-free life of hundreds of years can now be envisaged. Meanwhile, bionic man containing maintenance free, self-powered devices for his lifetime is an objective for the next few years.
How do these things work? Which technologies have the most potential now and in the future? What are the advantages and disadvantages of each? Which countries have the most active programs and why? What are the leading universities, developers, manufacturers and other players up to? What alliances exist? What are the timelines for success? All these questions and more are answered in this report.
First prepared in late 2008/ early 2009, is the fruit of global visits, literature searches and interviews by technically qualified IDTechEx staff. IDTechEx stages the largest conferences in three continents on Printed Electronics and the only major conferences on Real Time Locating Systems/Wireless Sensor Networks and Photovoltaics beyond Conventional Silicon, plus a major RFID conference. These and its widespread technical and marketing consultancy business provides unique insight into what is happening and about to happen. IDTechEx has offices in the USA, UK, Germany, Poland and New Zealand and is setting up an office in Japan. Its staff speak many languages, travel intensively and are well placed to see the future.
Table of Content

1. EXECUTIVE SUMMARY AND CONCLUSIONS
1.1. Market forecast 2012-2022, 2032

2. INTRODUCTION
2.1. What is energy harvesting?
2.2. What it is not
2.3. Energy harvesting compared with alternatives
2.4. Power requirements of different devices
2.5. Harvesting options to meet these requirements
2.6. Battery advances fail to keep up - implications
2.7. Some key enablers for the future - printed electronics, smart substrates, MEMS
2.7.1. Printed and thin film
2.7.2. Smart substrates
2.7.3. MEMS

3. APPLICATIONS AND POTENTIAL APPLICATIONS
3.1. Aerospace and military
3.2. Industrial
3.2.1. Standards - EnOcean Alliance vs ZigBee
3.2.2. Real Time Locating Systems
3.2.3. Wireless Sensor Networks (WSN)
3.2.4. Aircraft, engines, automotive and machinery
3.3. Consumer
3.3.1. Mobile phones, wristwatches, radio, lamps etc
3.3.2. E-Labels, E-Packaging, E-signage, E-posters
3.3.3. Textiles
3.4. Healthcare
3.5. Third World
3.6. Environmental

4. HARVESTING-TOLERANT ELECTRONICS, DIRECT USE OF POWER, STORAGE OPTIONS
4.1. Harvesting tolerant electronics and direct use of power
4.1.1. Progress with harvesting tolerant electronics
4.2. New battery options
4.2.1. Smart Dust
4.2.2. Lithium laminar batteries
4.2.3. Planar Energy Devices
4.2.4. Cymbet Corporation - integrated battery management
4.2.5. Infinite Power Solutions
4.2.6. Transparent printed organic batteries
4.2.7. Biobatteries do their own harvesting
4.2.8. Battery that incorporates energy harvesting - FlexEl
4.2.9. Technion Israel Institute of Science
4.2.10. Need for shape standards for laminar batteries
4.3. Alternatives to batteries
4.3.1. Supercapacitors
4.3.2. Supercapacitors and Supercabatteries
4.3.3. Supercabatteries
4.3.4. Mini fuel cells

5. LIGHT HARVESTING FOR SMALL DEVICES
5.1. Comparison of options
5.1.1. Important parameters
5.1.2. Principles of operation
5.1.3. Options for the future
5.1.4. Many types of photovoltaics needed for harvesting
5.2. Limits of cSi and aSi technologies
5.3. Limits of CdTe
5.4. GaAsGe multilayers
5.5. DSSC
5.6. CIGS
5.7. Organic
5.8. Nanosilicon ink
5.9. Nantennas
5.10. Other options
5.10.1. Nanowire solar cells

6. MOVEMENT HARVESTING
6.1. Vibration harvesting
6.2. Movement harvesting options
6.2.1. Piezoelectric - conventional, ZnO and polymer
6.2.2. Electrostatic
6.2.3. Magnetostrictive
6.2.4. Energy harvesting electronics
6.3. Electroactive polymers
6.4. MEMS
6.5. Electrodynamic
6.5.1. Generation of electricity
6.5.2. Harvesting from the human heart
6.5.3. Bridge monitoring
6.5.4. Wind up foetal heart rate monitor

7. HEAT HARVESTING
7.1. Thermoelectrics
7.1.1. Thermoelectric construction
7.1.2. Advantages of thermoelectrics
7.1.3. Automotive Thermoelectric Generation (ATEG)
7.1.4. Heat pumps

8. OTHER HARVESTING OPTIONS
8.1. Electromagnetic field harnessing
8.2. Microbial and other fuel cells
8.3. Multiple energy harvesting

9. PROFILES OF PARTICIPANTS IN 22 COUNTRIES
9.2. Advanced Cerametrics
9.3. Agency for Defense Development
9.4. AIST Tsukuba
9.5. Alabama A.&M. University
9.6. Alps Electric
9.7. Ambient Research
9.8. AmbioSystems LLC
9.9. Applied Digital Solutions
9.10. Argonne National Laboratory
9.11. Arizona State University
9.12. Arveni
9.13. Australian National University - Department of Engineering
9.14. Avago Technologies General
9.15. BAE Systems
9.16. Boeing
9.17. California Institute of Technology
9.18. California Institute of Technology/Jet Propulsion Laboratory
9.19. California State University - Northridge
9.20. Cambrian Innovation (formerly IntAct)
9.21. Carnegie Mellon University
9.22. CEA (Atomic Energy Commission of France)
9.23. Chinese University of Hong Kong
9.24. Chungbuk National University
9.25. Citizen Holding Co Ltd
9.26. China National Space Administration
9.27. Clarkson University
9.28. Cymtox Ltd
9.29. Drexel University
9.30. East Japan Railway Company
9.31. EDF R&D
9.32. Electronics and Telecommunications Research Institute (ETRI)
9.33. Ember Corporation
9.34. Encrea srl
9.35. European Space Agency
9.36. Exergen
9.37. Fast Trak Ltd
9.38. Fatih University
9.39. Ferro Solutions, Inc.
9.40. Fraunhofer Institut Integrierte Schaltungen
9.41. Freeplay Foundation
9.42. G24 Innovations
9.43. Ganssle Group
9.44. Gas Sensing Solution Ltd
9.45. General Electric Company
9.46. Georgia Institute of Technology
9.47. GreenPeak Technologies
9.48. Harvard University
9.49. High Merit Thermoelectrics
9.50. Hi-Tech Wealth
9.51. Holst Centre
9.52. Honeywell
9.53. Idaho National Laboratory
9.54. IMEC
9.55. Imperial College
9.56. India Space Research Organisation
9.57. Intel
9.58. ITRI (Industrial Technology Research Institute)
9.59. Japan Aerospace Exploration Agency
9.60. Kanazawa University
9.61. KCF Technologies Inc
9.62. Kinergi Pty Ltd
9.63. Kinetron BV
9.64. Kobe University
9.65. Konarka
9.66. Kookmin University,
9.67. Korea Electronics Company
9.68. Korea Institute of Science and Technology
9.69. Korea University
9.70. Lawrence Livermore National Laboratory
9.71. Lear Corporation
9.72. Lebônê Solutions
9.73. Leviton
9.74. Lockheed Martin Corporation
9.75. LV Sensors, Inc.
9.76. Massachusetts Institute of Technology
9.77. MEMSCAP SA
9.78. Michigan Technological University
9.79. Microdul AG
9.80. Micropelt GmbH
9.81. Microsemi
9.82. MicroStrain Inc.
9.83. Midé Technology Corporation
9.84. MINIWIZ Sustainable Energy Dev. Ltd
9.85. Mitsubishi Corporation
9.86. Nanosonic Inc
9.87. NASA
9.88. National Physical Laboratory
9.89. National Semiconductor
9.90. National Taiwan University,
9.91. National Tsing Hua University
9.92. Network Rail Infrastructure Ltd
9.93. Newcastle University
9.94. Nextreme
9.95. Nokia Cambridge UK Research Centre
9.96. North Carolina State University
9.97. Northrop Grumman
9.98. Northeastern University
9.99. Northwestern University
9.100. Nova Mems
9.101. NTT DOCOMO
9.102. Oak Ridge National Laboratory
9.103. Ohio State University
9.104. Omron Corporation
9.105. Pacific Northwest National Laboratory
9.106. Pavegen
9.107. Pennsylvania State University
9.108. Perpetua
9.109. Perpetuum Ltd
9.110. Polatis Photonics
9.111. POWERLeap
9.112. PowerFilm, Inc.
9.113. PulseSwitch Systems
9.114. Purdue University
9.115. Rockwell Automation
9.116. Rockwell Scientific
9.117. Rosemount, Inc.
9.118. Rutherford Appleton Laboratory,
9.119. Sagentia
9.120. Sandia National Laboratory
9.121. Satellite Services Ltd
9.122. Siemens Power Generation
9.123. Scuola Superiore Sant'Anna
9.124. Seiko
9.125. SELEX Galileo
9.126. Sentilla Corporation
9.127. Shanghai Jiao Tong University
9.128. Simon Fraser University
9.129. Smart Material Corp.
9.130. SMH
9.131. Solarprint
9.132. Solid State Research inc
9.133. Sony
9.134. Southampton University Hospital
9.135. SPAWAR
9.136. Spectrolab Inc
9.137. State University of New Jersey
9.138. Swiss Federal Institute of Technology
9.139. Syngenta Sensors UIC
9.140. Technical University of Ilmenau
9.141. Thermolife Energy Corporation
9.142. The Technology Partnership
9.143. TIMA Laboratory
9.144. Tokyo Institute of Technology
9.145. Trophos Energy
9.146. TRW Conekt
9.147. Tyndall National Institute
9.148. University of Berlin
9.149. University of Bristol
9.150. University of California Berkeley
9.151. University of California Los Angeles
9.152. University of Edinburgh
9.153. University of Florida
9.154. University of Freiburg - IMTEK
9.155. University of Idaho
9.156. University of Michigan
9.157. University of Neuchatel
9.158. University of Oxford
9.159. University of Pittsburgh
9.160. University of Princeton
9.161. University of Sheffield
9.162. University of Southampton
9.163. University of Tokyo
9.164. Uppsala University
9.165. US Army Research Laboratory
9.166. Virginia Tech
9.167. Voltaic Systems Inc
9.168. Washington State University
9.169. Wireless Industrial Technologies
9.170. Yale University,
9.171. Yonsei University,
9.172. ZMD AG

10. THE ENOCEAN ALLIANCE
10.1. Promoters
10.1.1. BSC Computer GmbH - Germany
10.1.2. EnOcean -Germany
10.1.3. Leviton - United States
10.1.4. Masco - United States
10.1.5. MK Electric (a Honeywell Business) - United Kingdom
10.1.6. Omnio - Switzerland
10.1.7. OPUS greenNet - Germany
10.1.8. Texas Instruments - United States
10.1.9. Thermokon Sensortechnik - Germany
10.2. Participants
10.2.1. ACTE .PL
10.2.2. Ad Hoc Electronics - United States
10.2.3. Atlas Group
10.2.4. b.a.b technologie GmbH - Germany
10.2.5. Beckhoff - Germany
10.2.6. bk-electronic GmbH
10.2.7. BootUp GmbH - Switzerland
10.2.8. BSC Computer GmbH
10.2.9. Cozir - United Kindom
10.2.10. Denro - Germany
10.2.11. Distech Controls - Canada
10.2.12. DRSG
10.2.13. EchoFlex Solutions
10.2.14. EHRT
10.2.15. Elsner Elektronik - Germany
10.2.16. Eltako GmbH
10.2.17. Emerge Alliance
10.2.18. Ex-Or - United Kindom
10.2.19. Funk Technik - Germany
10.2.20. GE Energy - United States
10.2.21. GFR - Germany
10.2.22. Hansgrohe Group - Germany
10.2.23. Hautau - Germany
10.2.24. HESCH - Germany
10.2.25. Hoppe - Germany
10.2.26. Hotel Technology Next Generation - United States
10.2.27. IK Elektronik GmbH - Germany
10.2.28. ILLUMRA - United States
10.2.29. INSYS Electronics
10.2.30. Intesis Software SL - Spain
10.2.31. IP Controls - Germany
10.2.32. Jager Direkt GmbH & Co
10.2.33. Kieback&Peter GmbH & Co. KG - Germany
10.2.34. LonMark International
10.2.35. Lutuo - China
10.2.36. Magnum Energy Solutions LLC - United States
10.2.37. Murata Europe - Germany
10.2.38. Osram
10.2.39. Osram Silvania
10.2.40. OVERKIZ - Germany
10.2.41. PEHA
10.2.42. PEHA - Germany
10.2.43. PROBARE
10.2.44. Regulvar
10.2.45. Reliable Controls - Canada
10.2.46. S+S Regeltechnik
10.2.47. S4 Group - United States
10.2.48. Sauter
10.2.49. Schulte Elektrotechnik GmbH & Co. KG
10.2.50. SCL Elements Inc - Canada
10.2.51. SensorDynamics AG
10.2.52. Servodan A/S
10.2.53. Shaspa - United Kingdom
10.2.54. Siemens Building Technologies - Switzerland
10.2.55. Siemens Building Technologies GmbH & Co
10.2.56. SmartHome Initiative - Germany
10.2.57. SOMMER - Germany
10.2.58. Spartan Peripheral Devices - Canada
10.2.59. Spega - Germany
10.2.60. steute Schaltgeräte GmbH & Co. KG
10.2.61. Texas Instruments
10.2.62. Titus - United States
10.2.63. Unitronic AG Zentrale - Germany
10.2.64. Unotech A/S - Denmark
10.2.65. USNAP - United States
10.2.66. Vicos - Austria
10.2.67. Viessmann Group - Germany
10.2.68. Vossloh-Schwabe - Germany
10.2.69. WAGO Kontakttechnik GmbH & Co. KG - Germany
10.2.70. Wieland Electric GmbH - Germany
10.2.71. YTL Technologies - China
10.2.72. Zumtobel Lighting GmbH - Austria
10.3. Associates
10.3.1. A. & H. MEYER GmbH - Germany
10.3.2. ABC Shop 24 - Germany
10.3.3. Active Business Company GmbH
10.3.4. Akktor GmbH - Germany
10.3.5. Alvi Technologies
10.3.6. ASP Automação - Brazil
10.3.7. Axis Lighting - Canada
10.3.8. Biberach University of Applied Sciences
10.3.9. bmd AG -Switzerland
10.3.10. BMS Systems
10.3.11. Building Intelligence Group LLC - United States
10.3.12. CAO Group, Inc. - United States
10.3.13. Circuit Holding - Egypt
10.3.14. Com-Pacte - France
10.3.15. Cymbet - United States
10.3.16. Dauphin - Germany
10.3.17. DigiTower Cologne
10.3.18. DimOnOff - Canada
10.3.19. Distech Controls
10.3.20. Dogma Living Technology - Greece
10.3.21. Elektro-Systeme Matthias Friedl - Germany
10.3.22. Elka Hugo Krischke GmbH - Germany
10.3.23. Encelium Technologies - United States
10.3.24. Energie Agentur
10.3.25. enexoma AG - Germany
10.3.26. Engenuity Systems
10.3.27. Engenuity Systems - United States
10.3.28. Engineered Tax Services - United States
10.3.29. EnOcean GmbH
10.3.30. Enolzu - Spain
10.3.31. Enotech - Denmark
10.3.32. ESIC Technology & Sourcing Co., Ltd.
10.3.33. Functional Devices Inc. - United States
10.3.34. Gesteknik
10.3.35. Green Link Alliance
10.3.36. Gruppo Giordano - Italian
10.3.37. Hagemeyer - Germany
10.3.38. HBC Hochschule Biberach - Germany
10.3.39. Herbert Waldmann GmbH & Co. KG - Germany
10.3.40. Hermos - Germany
10.3.41. HK Instruments - Finland
10.3.42. Hochschule Luzern - Technik & Architektur - Switzerland
10.3.43. I.M. tecnics - Spain
10.3.44. Indie Energy - United States
10.3.45. Infinite Power Solutions, Inc. - United States
10.3.46. Ingenieurbüro Knab GmbH - Germany
10.3.47. Ingenieurbüro Zink GmbH
10.3.48. Ingenieurbüro Zink GmbH - Germany
10.3.49. INGLAS Innovative Glassysteme GmbH & Co. KG
10.3.50. Interior Automation - United Kingdom
10.3.51. Ivory Egg - United Kingdom
10.3.52. Kaga Electronics - Japan
10.3.53. KIB Projekt GmbH
10.3.54. Korea Electronics Technology Institute (KETI) - Korea
10.3.55. KVL Comp Ltd.
10.3.56. Ledalite - Canada
10.3.57. LessWire, LLC
10.3.58. Lighting Control & Design - United States
10.3.59. LogiCO2 International SARL. - Luxembourg
10.3.60. Masco
10.3.61. Mitsubishi Materials Corporation - United States
10.3.62. MK Electric (a Honeywell Business)
10.3.63. MONDIAL Electronic GmbH - Austria
10.3.64. Moritani - Japan
10.3.65. Moritani and Co Ltd
10.3.66. MW-Elektroanlagen - Germany
10.3.67. myDATA - Germany
10.3.68. Nibblewave - France
10.3.69. OBERMEYER Planen + Beraten GmbH - Germany
10.3.70. Omnio
10.3.71. Orkit Building Intelligence
10.3.72. Pohlmann Funkbussystems - Germany
10.3.73. PressFinish GmbH - Germany
10.3.74. Prulite Ltd - United States
10.3.75. Pyrecap - France
10.3.76. PYRECAP/HYCOSYS
10.3.77. R+S Group - Germany
10.3.78. SANYO Semiconductor LLC. - United States
10.3.79. SAT Herbert GmbH
10.3.80. SAT System- und Anlagentechnik Herbert GmbH
10.3.81. Seamless Sensing - United Kingdom
10.3.82. Selmoni - Switzerland
10.3.83. Sensocasa - Germany
10.3.84. Seven Line Control Systems - France
10.3.85. SIFRI, S.L. - Spain
10.3.86. SmartLiving Asia - Hong Kong
10.3.87. Spittler Lichttechnik GmbH - Germany
10.3.88. Spoon2 International Limited - United Kingdom
10.3.89. Steinbeis Transferzentrum für Embedded Design und Networking
10.3.90. StyliQ - Germany
10.3.91. STZEDN - Germany
10.3.92. Suffice Group - Hong Kong
10.3.93. Tambient
10.3.94. Tambient - United States
10.3.95. Technograph Microcircuits Ltd
10.3.96. Teleprofi-Verbindet - Germany
10.3.97. Thermokon - Danelko Elektronik AB - Sweden
10.3.98. ThermoKon Sensortechnik
10.3.99. t-mac Technologies Limited - United Kingdom
10.3.100. Tridum - United States
10.3.101. TRILUX GmbH & Co. KG - Germany
10.3.102. Unitronic AG Zentrale
10.3.103. Vicos
10.3.104. Vity Technology - Hong Kong
10.3.105. WAGO Kontakttechnik GmbH & Co. KG
10.3.106. WeberHaus - Germany
10.3.107. Web-IT - Germany
10.3.108. WelComm - United States
10.3.109. Wieland Electric GmbH
10.3.110. WIT - France
10.3.111. WM Ocean - Czech Republic
10.3.112. Yongfu - Singapore
10.3.113. Zurich University of Applied Science (ZHAW) - Switzerland

11. MARKET FORECASTS
11.1. Forecasts for energy harvesting markets
11.1.1. Addressable markets and price sensitivity
11.1.2. IDTechEx energy harvesting forecasts 2012-2022, 2032
11.1.3. Timeline for widespread deployment of energy harvesting
11.1.4. Which technologies win?
11.2. Wireless sensor networks 2010-2022
11.3. IDTechEx forecast for 2032
11.4. Bicycle dynamo market

APPENDIX 1: IDTECHEX PUBLICATIONS AND CONSULTANCY

APPENDIX 2: WIRELESS SENSOR NETWORKS

APPENDIX 3: PERMANENT POWER FOR WIRELESS SENSORS - WHITE PAPER FROM CYMBET

List of Tables

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List of Figures

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